Advanced Technologies
| SiP( System in Package) /SiM (System in Module) |
Process-related services such as SiP, SiM packaging structure, electrical property, heat transfer, stress design analysis and production, fan out, WLCSP/stacking , component internal setting, etc. |
| FPC(Flexible Printed Circuit) |
Hardware specs, element characteristic simulation and measurement Wafer sensor element system integration Customized wafer evaluation and design assistance FPC(Flexible Printed Circuit) |
| Smart AIoT Applications |
AIoT Structure Introduction and Integration Evaluation AI Model Optimization and Deployment |